Heat Sink Market is Dazzling Worldwide and Forecast to 2030

Heat sink market is anticipated to grow at a considerable CAGR of 6.8% during the forecast period (2024-2031). A heat sink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature.

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The relentless pursuit of ever-increasing processing power in electronics, from smartphones to powerful computers, presents a hidden challenge: heat generation. These high-powered devices produce significant thermal output, potentially leading to malfunctions and reduced lifespans. For instance, in September 2023, The A17 Pro mobile chip in Apple's newest smartphone, the iPhone 15 Pro, overheated excessively, causing controversy surrounding the device. With this chip, TSMC begins mass-producing 3-nm chips.Recently, a Chinese user reported that, within 30 minutes of playing demanding games, the iPhone 15 Pro's temperature shot up to 48°C. When semiconductor chips overheat, it usually means that there are design defects or manufacturing process problems, like power leakage that is not contained. To address this critical issue, the demand for heat sinks is experiencing a significant surge. Functioning as miniature radiators, heat sinks absorb and dissipate heat, ensuring optimal operating temperatures and prolonged device functionality. As electronic devices continue to pack more processing power, the need for efficient heat sinks will undoubtedly continue to climb in the era of high-performance electronics.

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  • Market Coverage

  • Market number available for – 2024-2031

  • Base year- 2024

  • Forecast period- 2024-2031

  • Segment Covered- By Source, By Product Type, By Applications

  • Competitive Landscape- Archer Daniels Midland Co., Ingredion Inc., Kerry Group Plc, Cargill

  • , and others


Market Segmentation

Global Heat Sink Market by Material

  • Aluminum

  • Copper

  • Others (Graphite, Diamond, Alloys)


Global Heat Sink Market by Applications

  • Computer Processors

  • LED Lighting

  • Automotive Industry

  • Aerospace Industry

  • Consumer Electronics

  • Others (Healthcare and Energy)


Global Heat Sink Market by Type

  • Active Heat Sinks

  • Passive Heat Sinks

  • Hybrid Heat Sinks


Regional Analysis

  • North America

  • United States

  • copyright

  • Europe

  • UK

  • Germany

  • Italy

  • Spain

  • France

  • Rest of Europe

  • Asia-Pacific

  • China

  • India

  • Japan

  • South Korea

  • Rest of Asia-Pacific

  • Rest of the World

  • Latin America

  • The Middle East & Africa


Company Profiles 

  • Aavid (Boyd Corp.)

  • AavidThermalloy, LLC

  • ABL (Aluminium Components) Ltd (Amari Group)

  • Advanced Thermal Solutions, Inc

  • Alpha Company Ltd.

  • Apex Microtechnology

  • Boyd Corp.

  • C&H Technology, Inc.

  • CUI Devices

  • OhmiteMfg Co.

  • PSI Industries, Inc.

  • Wakefield Thermal, Inc.


The Report Covers

  • Market value data analysis of 2023 and forecast to 2031.

  • Annualized market revenues ($ million) for each market segment.

  • Country-wise analysis of major geographical regions.

  • Key companies operating in the globalheat sink. Based on the availability of data, information related to new product launches, and relevant news is also available in the report.

  • Analysis of business strategies by identifying the key market segments positioned for strong growth in the future.

  • Analysis of market-entry and market expansion strategies.


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